Home > Copper Clad Laminates > Rogers DiClad 870 DK2.33 Df0.0013 (0.79-3.18mm) Copper Clad Laminate

Rogers DiClad 870 Laminate
Material:Rogers DiClad 870 / Woven Fiberglass/PTFE Composite with ED Copper
MOQ:1 Sheet
Price:219-849 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal
 

Rogers DiClad 870 DK2.33 Df0.0013 (0.79-3.18mm) Copper Clad Laminate


Brief Introduction

DiClad laminates are woven fiberglass/PTFE composite materials used as printed circuit board substrates. They provide greater dimensional stability compared to nonwoven fiberglass reinforced PTFE laminates of similar dielectric constants. The consistency and control of the PTFE coated fiberglass cloth result in better dielectric constant uniformity. DiClad laminates are frequently used in filter, coupler, low noise amplifier, power divider, and combiner applications where dielectric constant uniformity and low loss are critical.


Technical Features & Benefits

  • Woven Fiberglass Reinforcement: Provides superior dimensional stability for reliable circuit fabrication.
  • Controlled PTFE/Fiberglass Ratio: Ensures consistent dielectric properties across panels and batches.
  • Low Dielectric Constant and Dissipation Factor: DK of 2.33 and Df of 0.0013 at 10 GHz for excellent signal integrity.
  • Excellent Dielectric Constant Uniformity: Critical for high-performance filters, couplers, and power dividers.
  • Suitable for High-Frequency and Low-Loss Applications: Ideal for demanding RF and microwave circuits.

Rogers DiClad 870 Laminate


Typical Properties: DiClad 870

Properties Test Conditions Typical Value Units Test Method
ELECTRICAL PROPERTIES
Dielectric Constant23°C @ 50% RH, 10 GHz2.33-IPC TM-650 2.5.5.5
Dielectric Constant23°C @ 50% RH, 1 MHz2.33-IPC TM-650 2.5.5.3
Dissipation Factor23°C @ 50% RH, 10 GHz0.0013-IPC TM-650 2.5.5.5
Dissipation Factor23°C @ 50% RH, 1 MHz0.0009-IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric Constant-10 to 140°C, 10 GHz-161ppm/°CIPC TM-650 2.5.5.5
Volume ResistivityC96/35/901.5 x 10⁹MΩ-cmIPC TM-650 2.5.17.1
Surface ResistivityC96/35/903.4 x 10⁷IPC TM-650 2.5.17.1
Dielectric BreakdownD48/50>45kVASTM D-149
Arc Resistance->180-ASTM D-495
THERMAL PROPERTIES
Coefficient of Thermal Expansion - x50°C to 150°C17ppm/°CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - y50°C to 150°C29ppm/°CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - z50°C to 150°C217ppm/°CIPC TM-650 2.4.24
Thermal Conductivity-0.26W/(m·K)ASTM E1461
MECHANICAL PROPERTIES
Copper Peel Strength10s @ 288°C, 35 μm foil14lbs/inIPC TM-650 2.4.8
Young's Modulus23°C @ 50% RH485, 346kpsiASTM D-638
Tensile Strength (MD, CMD)23°C @ 50% RH14.9, 11.2kpsiASTM D-882
Compressive Modulus23°C @ 50% RH327kpsiASTM D-695
Flex Modulus23°C @ 50% RH437kpsiASTM D-3039
PHYSICAL PROPERTIES
FlammabilityC48/23/50 & C168/70V-0-UL 94
Moisture AbsorptionE1/105+D24/230.02%IPC TM-650 2.6.2.2
DensityC24/23/50, Method A2.26g/cm³ASTM D792
NASA Outgassing - Total Mass Lost125°C, ≤10⁻⁶ torr0.02%NASA SP-R-0022A
NASA Outgassing - Collected Volatiles125°C, ≤10⁻⁶ torr0.00%NASA SP-R-0022A
NASA Outgassing - Water Vapor Recovered125°C, ≤10⁻⁶ torr0.01%NASA SP-R-0022A

Application Areas

  • Filters: Bandpass, low-pass, and high-pass filters requiring precise DK control.
  • Couplers: Directional couplers and hybrid couplers for signal distribution.
  • Low Noise Amplifiers (LNAs): Front-end amplifiers in receivers where low loss is critical.
  • Power Dividers and Combiners: Wilkinson dividers and other power distribution networks.
  • Applications requiring dielectric constant uniformity and low loss: General high-frequency circuit designs.

Available Configurations

  • Typical Thicknesses: 0.031" (0.79mm) ±0.0020", 0.093" (2.36mm) ±0.0030", 0.125" (3.18mm) ±0.0060".
  • Available Sheet Sizes: 8" x 12" (203 x 305mm), 18" x 24" (475 x 610mm).
  • Standard Claddings: Electrodeposited Copper Foil: 1/2 oz. (18µm), 1 oz. (35µm). Rolled Copper Foil: 1/2 oz. (18µm), 1 oz. (35µm).
 

Get a Quick Quote

Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for Rogers DiClad 870 Laminate.

No file chosen

Max 10MB/file: .zip, .pdf, .jpg, .png, .txt (multiple)

Your information is safe. We'll respond within 24 hours.

Previous Taconic TLY-3 DK2.33 Df0.0012 (0.09-1.52mm) Copper Clad Laminate

Next Rogers CuClad 233 DK2.33 Df0.0013 (Various Thickness) PTFE PCB Board Material