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Rogers DiClad 870 DK2.33 Df0.0013 (0.79-3.18mm) Copper Clad Laminate
Brief Introduction
DiClad laminates are woven fiberglass/PTFE composite materials used as printed circuit board substrates. They provide greater dimensional stability compared to nonwoven fiberglass reinforced PTFE laminates of similar dielectric constants. The consistency and control of the PTFE coated fiberglass cloth result in better dielectric constant uniformity. DiClad laminates are frequently used in filter, coupler, low noise amplifier, power divider, and combiner applications where dielectric constant uniformity and low loss are critical.
Technical Features & Benefits
- Woven Fiberglass Reinforcement: Provides superior dimensional stability for reliable circuit fabrication.
- Controlled PTFE/Fiberglass Ratio: Ensures consistent dielectric properties across panels and batches.
- Low Dielectric Constant and Dissipation Factor: DK of 2.33 and Df of 0.0013 at 10 GHz for excellent signal integrity.
- Excellent Dielectric Constant Uniformity: Critical for high-performance filters, couplers, and power dividers.
- Suitable for High-Frequency and Low-Loss Applications: Ideal for demanding RF and microwave circuits.
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Typical Properties: DiClad 870
| Properties |
Test Conditions |
Typical Value |
Units |
Test Method |
| ELECTRICAL PROPERTIES | | | | |
| Dielectric Constant | 23°C @ 50% RH, 10 GHz | 2.33 | - | IPC TM-650 2.5.5.5 |
| Dielectric Constant | 23°C @ 50% RH, 1 MHz | 2.33 | - | IPC TM-650 2.5.5.3 |
| Dissipation Factor | 23°C @ 50% RH, 10 GHz | 0.0013 | - | IPC TM-650 2.5.5.5 |
| Dissipation Factor | 23°C @ 50% RH, 1 MHz | 0.0009 | - | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of Dielectric Constant | -10 to 140°C, 10 GHz | -161 | ppm/°C | IPC TM-650 2.5.5.5 |
| Volume Resistivity | C96/35/90 | 1.5 x 10⁹ | MΩ-cm | IPC TM-650 2.5.17.1 |
| Surface Resistivity | C96/35/90 | 3.4 x 10⁷ | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Breakdown | D48/50 | >45 | kV | ASTM D-149 |
| Arc Resistance | - | >180 | - | ASTM D-495 |
| THERMAL PROPERTIES | | | | |
| Coefficient of Thermal Expansion - x | 50°C to 150°C | 17 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 50°C to 150°C | 29 | ppm/°C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 50°C to 150°C | 217 | ppm/°C | IPC TM-650 2.4.24 |
| Thermal Conductivity | - | 0.26 | W/(m·K) | ASTM E1461 |
| MECHANICAL PROPERTIES | | | | |
| Copper Peel Strength | 10s @ 288°C, 35 μm foil | 14 | lbs/in | IPC TM-650 2.4.8 |
| Young's Modulus | 23°C @ 50% RH | 485, 346 | kpsi | ASTM D-638 |
| Tensile Strength (MD, CMD) | 23°C @ 50% RH | 14.9, 11.2 | kpsi | ASTM D-882 |
| Compressive Modulus | 23°C @ 50% RH | 327 | kpsi | ASTM D-695 |
| Flex Modulus | 23°C @ 50% RH | 437 | kpsi | ASTM D-3039 |
| PHYSICAL PROPERTIES | | | | |
| Flammability | C48/23/50 & C168/70 | V-0 | - | UL 94 |
| Moisture Absorption | E1/105+D24/23 | 0.02 | % | IPC TM-650 2.6.2.2 |
| Density | C24/23/50, Method A | 2.26 | g/cm³ | ASTM D792 |
| NASA Outgassing - Total Mass Lost | 125°C, ≤10⁻⁶ torr | 0.02 | % | NASA SP-R-0022A |
| NASA Outgassing - Collected Volatiles | 125°C, ≤10⁻⁶ torr | 0.00 | % | NASA SP-R-0022A |
| NASA Outgassing - Water Vapor Recovered | 125°C, ≤10⁻⁶ torr | 0.01 | % | NASA SP-R-0022A |
Application Areas
- Filters: Bandpass, low-pass, and high-pass filters requiring precise DK control.
- Couplers: Directional couplers and hybrid couplers for signal distribution.
- Low Noise Amplifiers (LNAs): Front-end amplifiers in receivers where low loss is critical.
- Power Dividers and Combiners: Wilkinson dividers and other power distribution networks.
- Applications requiring dielectric constant uniformity and low loss: General high-frequency circuit designs.
Available Configurations
- Typical Thicknesses: 0.031" (0.79mm) ±0.0020", 0.093" (2.36mm) ±0.0030", 0.125" (3.18mm) ±0.0060".
- Available Sheet Sizes: 8" x 12" (203 x 305mm), 18" x 24" (475 x 610mm).
- Standard Claddings: Electrodeposited Copper Foil: 1/2 oz. (18µm), 1 oz. (35µm). Rolled Copper Foil: 1/2 oz. (18µm), 1 oz. (35µm).
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